0.5mm FPC&FFC Connector
huamao
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Ultra-Fine 0.5mm Pitch: Enables high-density interconnections, perfect for miniaturized PCBs and slim device designs.
Top- or Bottom-Contact Configurations: Offers design flexibility for various routing and assembly requirements.
Robust Actuation Systems:
ZIF (Zero Insertion Force): Ensures easy cable insertion and maximum reliability, preventing damage to fragile cables.
LIF (Low Insertion Force): A lower-profile alternative for applications where height is a critical constraint.
Flip-Lock / Hinge-Lock: Provides a secure, tactile lock with a simple flipping motion.
Surface-Mount (SMT) Design: Optimized for automated PCB assembly, ensuring high manufacturing throughput and consistent quality.
High-Temperature Resistance: Compatible with standard IR reflow soldering processes.
Sturdy Housing: Manufactured from heat-resistant LCP (Liquid Crystal Polymer) material for excellent mechanical strength and solderability.
Ideal for a wide range of consumer and industrial electronics where space and weight are critical:
Smartphones and Tablets
Digital Cameras and Camcorders
Drones and UAVs
Portable Medical Devices
LCD & OLED Displays
Laptop and Notebook Computers
Wearable Technology
Proven Reliability: Rigorous testing for durability, mating cycles, and environmental stress ensures long-term performance.
Global Supply Chain: Consistent quality and reliable delivery to meet your production schedules.
Expert Support: Our engineering team is ready to assist with design-in support and customization options.
